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By Jacques
Coderre, Universal Instruments Corporation
Binghamton, NY
and Robert Peter, Alphasem
Abstract
Die placement techniques all have the handling of semiconductor
devices in common. These techniques vary greatly, however, depending
on the assembly process used. The most widely used assembly process
involves attaching the die with silver-filled epoxy followed by
wire bonding to the substrate. For most of these wire bond applications,
the adhesive is dispensed directly on the placement machine. The
die is then placed active-side up on the substrate and cured.
This overall set of operations is typically referred to as the
die placement process.
Other techniques
have appeared recently in which the device is bumped and placed
active-side down on the substrate. This technique, known as flip
chip assembly, results in a quite different die placement process
than the wire bond approach. In this article, die placement techniques
for both wire bond and flip chip die attachment techniques will
be reviewed. In each case, equipment and process characteristics
will be presented and key machine and process issues discussed.
This paper
is available in PDF format. Please download.(uicdie.pdf.
file size: 380Kb)
(A 12/13/2000)
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